Firmware & bare-metal
C and C++ against the datasheet: peripheral drivers, DMA paths, interrupt latency budgets, secure bootloaders and low-power state machines that survive a real duty cycle.
Synapses Technologies LLC
Firmware, PCB, RTOS, robotics and connected fleets, engineered as one nervous system rather than a stack of parts.
01 / Capabilities
Most embedded products fail at the seams: between board and driver, driver and scheduler, device and cloud. We work across all of them, so the seams are ours to answer for.
C and C++ against the datasheet: peripheral drivers, DMA paths, interrupt latency budgets, secure bootloaders and low-power state machines that survive a real duty cycle.
Part selection, schematic, multilayer layout, power integrity and EMC-aware routing, then the unglamorous part: rails, clocks, JTAG and a board that boots.
Zephyr and FreeRTOS integration done deliberately: task decomposition, priority and locking discipline, deterministic control loops, and jitter measured rather than assumed.
BLE, Wi-Fi, LTE-M and LoRa stacks with a provisioning story, signed OTA, and telemetry that stays intelligible once there are ten thousand devices instead of one.
Motor control, sensor fusion, kinematics and ROS 2 bridges, from the current loop up to the behaviour a machine is actually judged on.
CAN and CAN-FD networks, UDS diagnostics, Modbus and industrial buses, plus the traceability and process discipline regulated programmes expect.
02 / Signal path
Every node is somebody's integration problem. A sensor reading becomes an interrupt, a task, a bus frame, a packet, a row in a dashboard. We design that path once, instrument it, and keep the latency and failure behaviour of each hop written down.
Schematic capture, layout, DFM review, first power-on and bring-up.
Drivers, bootloaders, power management and the timing budget that holds them.
RTOS tasks, schedulability, control loops and embedded Linux where it earns its place.
Provisioning, OTA, telemetry pipelines and the app or dashboard on the far end.
03 / How we work
Requirements, part shortlist, block diagram and a written timing and power budget. Ends in a spec you could hand to anyone.
Dev-kit or first-spin board with the risky subsystem proven first. Ends in a demonstrable device, not a slide.
Unit and hardware-in-the-loop tests, fault injection, EMC and thermal reality, CI on real targets. Ends in measured numbers.
Production programming, signed OTA, telemetry and a handover your own team can carry. Ends with you not needing us.
04 / Platforms
If your stack isn't here, it is usually a week of ramp, not a reason to change it.
05 / Request a quote
Tell us the device, the stage it's at and the deadline you're working against. You'll get a scoped estimate with assumptions listed, not a range with no reasoning.